Unimirror^® ASN-168 Sulfate Type Bright Tin Electroplating Process

Unimirror^® ASN-168 sulfate type bright tin plating process can obtain uniform bright tin deposits in wide curren density range. This coating contains very little organic matter and its solderability is excellent . It has been widely used in the electronic electroplating industry. It is suitable for electroplating of precision electronic products such as circuit boards, IC chips, LED brackets, and other terminals.

There are many advantages for this process, including:

A   Suitable for automatic plating.

B   Branded products with the most advanced formulation.

C   High current efficiency.

D  Green environmentally friendly technique, and easy to pass RoHS test.

Unimirror^® ASN-169 Sulfate Type Matte Tin Plating Process

Unimirror^® ASN-169 sulfate type matte tin plating process can obtain a uniform and matte tin deposits in wide temperature range. This depost contains very little organic matter and its solderability is excellent . It has been widely used in the electronic electroplating industry. It is suitable for electroplating of precision electronic products such as circuit boards, IC chips, LED brackets, and other terminals.

There are many advantages for this process, including:

A   Suitable for automatic production.

B   Branded products with the most advanced formulation.

C   High current efficiency.

D  Green environmentally friendly technique, and easy to pass RoHS test.

Unimirror^® TinEX 468 High Speed Bright Tin Plating Process

Unimirror^® TinEX 468 high-speed bright tin electroplating process belongs to methanesulfonate type tin plating system. Its deposits have excellent solderability and low organic content, which is especially suitable for electroplating electronic components. This process meets successfully the relevant test standards of the electronic industry (MID-STD-202F, 208F test method, and MID-STD-883C, 2003 test method).

There are many advantages for this process, including:

A   Preferred process for continuously plating of electronic products.

B   Branded products with the most advanced formulation.

C   High current efficiency, excellent throwing and leveling power.

D  Green environmentally friendly technique, and easy to pass RoHS test.

Unimirror^® TinEX 469 High-speed Matte Tin Plating Process

Unimirror^® TinEX 469 high-speed matte tin electroplating process belongs to methanesulfonate type tin plating system. Its deposits have excellent solderability and low organic content, which is especially suitable for electroplating electronic components. This process meets successfully the relevant test standards of the electronic industry (MID-STD-202F, 208F test method, and MID-STD-883C, 2003 test method).

There are many advantages for this process, including:

A   Preferred process for continuously plating of electronic products.

B   Branded products with the most advanced formulation.

C   High current efficiency, excellent throwing and leveling power.

D  Green environmentally friendly technique, and easy to pass RoHS test.